Thin Film Deposition

Trends, Key Issues, Market Analysis

TABLE OF CONTENTS

Chapter 1 

Introduction 

1-1

Chapter 2 

Executive Summary

2-1

Chapter 3

Physical Vapor Deposition

3-1

3.1

Introduction

3-1

3.2

Sputtering Technology

3-2

3.3

Plasma Technology

3-5

3.4

Reactor Designs

3-14

3.4.1

Long-Throw Deposition

3-14

3.4.2

Collimated Sputter Deposition

3-16

3.4.3

Showerhead Deposition

3-18

3.4.4

Ionized PVD

3-22

3.5

Semiconductor Processing

3-28

3.5.1

Feature Patterning

3-28

3.5.2

Gap Fill

3-31

3.6

Targets

3-34

Chapter 4

Chemical Vapor Deposition

4-1

4.1

Introduction

4-1

4.2

Chemical Vapor Deposition (CVD) Techniques

4-1

4.2.1

APCVD

4-1

4.2.2

LPCVD

4-5

4.2.3

PECVD

4-8

4.2.4

HDPCVD

4-13

4.2.5

ALD

4-19

Chapter 5 

Electrochemical Deposition

5-1

5.1

Introduction

5-1

5.2

Reactor Design

5-5

5.3

Challenges

5-6

5.4

Additives

5-8

5.5

Processing

5-9

5.5.1

Superfilling

5-9

5.5.2

Aspect Ratios

5-9

5.6

Copper Cathodes

5-10

Chapter 6 

Film Deposition And Film Properties

6-1

6.1

Introduction

6-1

6.2

Dielectric Deposition

6-4

6.2.1

Silicon Dioxide

6-5

6.2.1.1 

Thermal CVD

6-5

6.2.1.2 

PECVD

6-6

6.2.1.3 

HDPCVD

6-9

6.2.2

Silicon Nitride

6-13

6.2.2.1 

Thermal CVD

6-13

6.2.2.2 

PECVD

6-14

6.2.2.3 

HDPCVD

6-19

6.2.3

Other Oxides

6-19

6.2.4

Low-K Dielectrics

6-20

6.3

Metal Deposition

6-21

6.3.1

Aluminum

6-21

6.3.2

Tungsten/Tungsten Silicide

6-24

6.3.3

Titanium Nitride

6-26

Chapter 7 

Vendor Issues

7-1

7.1

Introduction

7-1

7.2

300mm Processing

7-6

7.3

Integrated Processing

7-9

7.4

Copper

7-13

7.5

Metrology

7-16

7.6

ESD

7-19

7.7

Parametric Test

7-20

Chapter 8 

Market Forecast

8-1

8.1

Introduction

8-1

8.2

Key Issues

8-4

8.3

Market Forecast Assumptions

8-6

8.4

Market Forecast

8-8

8.4.1

Chemical Vapor Deposition

8-8

8.4.2

Physical Vapor Deposition

8-24

8.4.3

Copper Electroplating Market

8-28

8.4.4

Atomic Layer Deposition Market

8-31

LIST OF FIGURES

3.1

Schematic Of Sputtering System

3-3

3.2

Magnetron Sputtering Design

3-9

3.3

Showerhead Reactor Design

3-19

3.4

Ionized PVD

3-24

4.1

APCVD Reactor

4-3

4.2

Tube CVD Reactor

4-7

4.3

HDPCVD Reactor

4-17

5.1

Copper Electroplating System

5-3

8.1

Worldwide MCVD Market Shares - 2002

8-12

8.2

Worldwide DCVD Market Shares - 2002

8-13

8.3

Worldwide DCVD Market By Sectors - 2002

8-15

8.4

Worldwide HDHCVD Market Shares - 2002

8-17

8.5

Worldwide PECVD Market Shares - 2002

8-19

8.6

Worldwide SACVD Market Shares - 2002

8-21

8.7

Worldwide LPCVD Market Shares - 2002

8-23

8.8

Worldwide PVD Market Shares - 2002

8-27

8.9

Worldwide ECD Market Shares - 2002

8-30

8.10

ALD Applications a Share of Market – 2002

8-35

8.11

Worldwide ALD Market Shares - 2002

8-36

LIST OF TABLES

8.1

Worldwide CVD Market Forecast

8-9

8.2

Worldwide MCVD Market Shares 1997-2002

8-10

8.3

Worldwide DCVD Market Shares - 1997-2002

8-11

8.4

Worldwide HDPCVD Market Shares - 2002

8-16

8.5

Worldwide PECVD Market Shares - 2002

8-18

8.6

Worldwide SACVD Market Shares - 2002

8-20

8.7

Worldwide LPCVD Market Shares - 1997-2002

8-22

8.8

Worldwide PVD Market Forecast

8-25

8.9

Worldwide PVD Market Shares 1994-2002

8-26

8.10

Worldwide ECD Market Forecast

8-29

8.11

Worldwide ALD Market Forecast

8-34