Markets and Strategies for Chemical and Material Suppliers in Niche Markets

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Markets and Strategies for Chemical and Material Suppliers in Niche Markets

TABLE OF CONTENTS

Chapter 1	Introduction	1-1

Chapter 2	Solar	2-1
2.1	Introduction	2-1
2.2	Crystalline and Polycrystalline Cell Manufacturing	2-4
2.2.1	Silicon Growing and Wafering	2-4
2.2.2	Etching and Texturig	2-7
2.2.3	Anti-Reflection Coatings	2-8
2.3	Thin Film Cell Manufacturing	2-8
2.3.1	Amorphous Silicon Deposition	2-8
2.3.2	Microcrystalline Silicon Deposition	2-10
2.3.3	CdTe – Cadmium Telluride Deposition	2-11
2.3.4	CIGS - Copper Indium Gallium Selenide Deposition	2-14
2.3.5	GaAs – Gallium Arsenide	2-21
2.4	Markets for Materials Suppliers	2-24
2.4.1	Crystalline and Polycrystalline Cell Forecast	2-24
2.4.2	Thin Film Cell Forecast	2-28
2.4.3	Chemicals and Materials Forecast	2-33
2.5	Nanomaterials As Solar Conversion	2-43
2.5.1	Inorganic Nanocrystals	2-46
2.5.2	CdSe And CdTe Nanorods	2-50
2.5.3	Quantum Dots	2-52
2.5.4	Nanocomposite – Quantum Dot Combination	2-53
2.5.5	Quantum Wells	2-54
2.5.6	Organic Polymers – Fullerenes	2-55
2.5.7	Ionic Organic Polymers	2-57
2.5.8	CIGS	2-57
2.5.9	Dye-Sensitized Solar Cells	2-60
2.5.10	Analysis Of Nanomaterial Markets For Solar Cells	2-63

Chapter 3	MEMs	3-1
3.1	The MEMS Market Infrastructure	3-1
3.2	Forecast Of The Key Applications And Markets	3-3
3.2.1	MEMS Device Market Forecast	3-3
3.2.2	MEMS System Market Forecast	3-15
3.3.2	Markets for Materials Suppliers	3-18

Chapter 4	HB-LEDs	4-1
4.1	Recent Progress in High Brightness LED Technology and Applications	4-1
4.2	Materials of Construction	4-10
4.2.1	Phosphor	4-10
4.2.2	Substrate	4-16
4.3	OLED Manufacturing	4-24
4.4	Outlook for the Worldwide OLED Market	4-31
4.5	Outlook for the Worldwide HB-LED Market	4-35

Chapter 5	Thin Film Read/Write Heads for HDD	5-1
5.1	Trends in HDDs	5-1
5.2	Recording Head Market Forecast	5-9
5.3	Head Processing	5-12
5.4	Head Fabrication –	5-17
5.5	Deposition Challenges	5-20
5.6	CMP Challenges	5-21
5.7	CMP Slurry Market	5-28
5.7.1	Ceria Slurry For Glass Disk Market	5-28
5.7.2	Oxide Slurry For Metal Disk Market	5-33
5.7.3	Oxide Slurry For Thin Film Head Market	5-36

Chapter 6	Wafer Level Processing (WLP)	6-1
6.1	Introduction	6-1
6.2	Flip Chip/WLP Processing Issues and Trends	6-2
6.2.1	Wafer Bumping	6-2
6.2.2	Wafer Level Packaging	6-6
6.2.3	Pad Redistribution	6-10
6.2.4	Wafer Bumping Costs	6-16
6.3	Metallization Issues and Trends	6-18
6.3.1	Gold Bumping Metallization	6-18
6.3.2	Solder Bumping Metallization	6-19
6.4	UBM Etch Issues And Trends	6-22
6.4.1	Etch Process	6-22
6.4.2	Etch Chemistry	6-24
6.5	Analysis of WLP Market	6-26

LIST OF FIGURES

2.1	Diagram Of Solar Cell	2-2
2.2	Cross Section Of A Solar Cell Under Illumination	2-3
2.3	Polysilicon Manufacturing And Supply Chain	2-6
2.4	Cross-Sectional Schematic Diagram Of The InGaP/InGaAs/Ge ATJ Cell	2-23
2.5	Percentage Gas Costs For Amorphous Silicon Solar Cell	2-42
3.1	MEMs Chemicals Forecast	3-20
3.2	MEMs Photomasks Forecast	3-23
3.3	MEMs Substrate Forecast	3-25
3.4	Forecast of MEMs Wafer Size	3-28
4.1	Operation of LED	4-2
4.2	Market drivers for LED Biz and Applications	4-6
4.3	SSL vs. Classical Technologies	4-7
4.4	LED Performance vs. Traditional Light Sources	4-8
4.5	Regular LED (white) Front-End Steps	4-12
4.6	Packaged LED Cost Basis	4-14
4.7	Packaged LED Cost Basis	4-15
4.8	Regular LED (White) Production Costs For 100k Wafers/Year	4-17
4.9	HB LED (White) Production Costs For 100k Wafers/Year	4-18
4.10	LED Cost Model: Impact Of Substrate Choice	4-19
4.11	Main Manufacturing Steps For GaN-Based Led	4-21
4.12	Schematic Of AMOLED	4-32
4-13	Active Matrix OLED Capacity And Demand Forecast	4-33
5.1	Hard Disk Drive Roadmap	5-2
5.2	Decrease In Average Price Of Storage	5-3
5.3	Heads Per Drive	5-5
5.4	Market Forecast Of Recording Head Consumption	5-10
5.5	Heads Per Drive Forecast	5-11
5.6	Thin Film Head Structure	5-13
5.7	Critical Features In Thin Film Head Structure	5-14
5.8	Spin Valve Head Structure	5-15
5.9	Cross-Sectional View TFH Stacks	5-18
5.10	Cross-Sectional View Of A TFH Design	5-19
5.11	CMP Slurry System For TFH Wafer Polishing	5-26
5-12	Total Slurry Consumption For HDD Forecast	5-38
6.1	Solder Bumping Process	6-4
6.2	Pillar-WLP CSP Process	6-11
6.3	Pad Redistribution Process	6-14

LIST OF TABLES

2.1	Historic Solar Cell Production By Region	2-25
2.2	Solar Cell Forecast	2-27
2.3	Market Share Of Solar Cells By Technology	2-29
2.4	Cost Comparison Of Thin Film Technologies	2-32
2.5	Polysilicon Production Capacities By Company	2-34
2.6	Affect Of Substrate Material On Cigs Solar Efficiency	2-37
2.7	Forecast Of Transparent Electrodes For Photovoltaics	2-39
2.8	Solar Materials Forecast – Crystalline Silicon Cells	2-41
3.1	MEMS Device Market Forecast	3-4
3.2	MEMS System Markets Forecast	3-17
4.1	Color, Wavelength Material Of LED	4-3
4.2	Comparison of LED, HB-LED, UHB-LED Characteristics	4-9
4.3	Production Method for Various LEDs	4-11
4.4	Comparison Of $/Klm For LED Made On Various 2" Susbtrates	4-20
4.5	Forecast Of Sapphire Substrate Size Distribution By Area	4-22
4.6	Sapphire Substrate Market Forecast	4-23
4-7	Projected Costs Of OLED Lighting Panels (Sheet Processed) Stage	4-28
4-8	Projected Costs Of OLED Lighting Panels (Web Processed) Stage	4-29
4.9	Global LED Market Forecast	4-44
5.1	Slurry And Abrasive Suppliers And Products	5-30
5.2	Worldwide Ceria Slurry For Glass Media Market Forecast	5-32
5.3	Worldwide Oxide Slurry For Metal Market Forecast	5-35
5.4	Worldwide Oxide Slurry For Thin Film Heads Market Forecast	5-37
6.1	Common UBM Stacks For Solder And Gold Bumping	6-3
6.2	Solder Bumping Guidelines	6-5
6.3	ITRS Pin Counts For Different Applications	6-7
6.4	Pillar-WLP CSP Guidelines	6-12
6.5	Pad Redistribution Guidelines	6-15
6.6	Common UBM Stacks For Gold And Solder Bumping	6-19
6.7	UBM Film Etchants	6-25
6.8	WLP Demand By Device (Units)	6-27
6.9	WLP Demand By Device (Wafers)	6-28