Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies

TABLE OF CONTENTS

Chapter 1

Introduction

1-1

Chapter 2

Niche Markets for PROCESSES for 300mm Wafers

2-1

2.1

Introduction

2-1

2.2

Wafer Level Processing (WLP)

2-3

2.2.1

Introduction

2-3

2.2.2

Flip Chip/WLP Processing Issues and Trends

2-4

o

Wafer Bumping

2-4

o

Wafer Level Packaging

2-8

o

Pad Redistribution

2-12

o

Wafer Bumping Costs

2-18

2.2.3

Lithography Issues And Trends

2-20

2.2.4

UBM Etch Issues And Trends

2-21

2.2.5

Metallization Issues and Trends

2-25

o

Gold Bumping Metallization

2-25

o

Solder Bumping Metallization

2-27

2.2.6

Analysis of WLP Market

2-29

2.3

3-D TSV

2-32

2.3.1

Insight Into Critical Issues

2-32

2.3.2

Cost Structure

2-33

2.3.3

Critical Processing Technologies

2-40

2.3.4

Evaluation Of Critical Development Segments

2-46

2.3.5

TSV Device Forecast

2-52

2.4

Non-volatile Memory Devices MRAM, RRAM and FeRAM 

2-55

2.4.1

Processing Requirements for MRAMs

2-60

2.4.2

Processing Requirements for RRAMs

2-62

2.4.3

Processing Requirements for FeRAMs

2-65

2.4.4

Roadmap for Commercialization

2-67

2.5

Ultrathin Wafers

2-70

2.5.1

Applications for Ultrathin Wafers

2-70

2.5.2

Substrate Thinning

2-71

2.5.3

Backside Metallization Requirements

2-77

2.5.4

Surface Stress Relief

2-79

2.5.5

Ultrathin Wafer Market

2-81

Chapter 3

Niche Markets for EQUIPMENT for SUB 300mm Wafers

3-1

3.1

Introduction

3-1

3.2

MEMs

3-3

3.2.1

The MEMS Market Infrastructure

3-3

3.2.2

Forecast Of The Key Applications And Markets

3-5

o

MEMS Device Market Forecast

3-5

o

MEMS System Market Forecast

3-17

3.2.3

Markets for Equipment and Materials Suppliers

3-20

3.3

HB-LEDs

3-40

3.3.1

Recent Progress in High Brightness LED Technology and Applications

3-40

3.3.2

Processing Equipment

3-49

3.3.3

Materials of Construction

3-61

3.3.4

OLED Manufacturing

3-65

3.3.5

Outlook for the Worldwide OLED Market

3-68

3.3.6

Outlook for the Worldwide HB-LED Market

3-72

3.4

Compound Semiconductors

3-83

3.4.1

GaAs Devices 

3-83

3.4.2

Equipment Trends

3-92

3.4.3

Wafer Sizes

3-104

3.4.4

GaAs IC Market Forecast

3-107

3.4.5

Competing Against SiGe

3-109

3.5

Thin Film Read/Write Heads for HDD

3-116

3.5.1

Trends in HDDs

3-117

3.5.2

Recording Head Market Forecast

3-126

3.5.3

Head Processing

3-129

3.5.4

Head Fabrication – CMP, Deposition, Lithography

3-134

3.5.5

CMP Challenges

3-139

3.5.6

Lithography Challenges

3-145

3.6

Bulk Acoustic Wave (BAW)

3-148

3.6.1

Basic Elements of the BAW Device

3-150

3.6.2

AlN Layer Quality Requirements

3-153

3.6.3

Equipment Requirements for BAW and FBAR Filtering Devices

3-157

3.6.4

Bulk Acoustic Wave (BAW) Market

3-158

TABLES

2.1

Common UBM Stacks For Solder And Gold Bumping

2-5

2.2

Solder Bumping Guidelines

2-7

2.3

ITRS Pin Counts For Different Applications

2-9

2.4

Pillar-WLP CSP Guidelines

2-14

2.5

Pad Redistribution Guidelines

2-17

2.6

UBM Film Etchants

2-24

2.7

Common UBM Stacks For Gold And Solder Bumping

2-26

2.8

WLP Demand By Device (Units)

2-30

2.9

WLP Demand By Device (Wafers)

2-31

2.10

Forecast Of TSV Devices By Wafers

2-53

3.1

MEMS Device Markets

3-6

3.2

MEMS System Markets

3-19

3.3

MEMS Equipment Markets

3-21

3.4

Color, Wavelength Material Of LED

3-42

3.5

Comparison of LED, HB-LED, UHB-LED Characteristics

3-48

3.6

Epitaxy Metrics from Initial Solid-State Lighting Manufacturing R&D Roadmap

3-55

3.7

Process Control Metrics

3-57

3.8

Production Method for Various LEDs

3-62

3.9

GaAs IC Market Forecast

3-108

3.10

Comparison Of Piezoelectric Materials For BAW Applications

3-154

FIGURES

2.1

Solder Bumping Process

2-6

2.2

Pillar-WLPCSP Process

2-13

2.3

Pad Redistribution Process

2-16

2.4

Via First (iTSV) Cost Of Ownership

2-34

2.5

Via First (iTSV) Cost Of Ownership Front And Back Side

2-36

2.6

Via First (iTSV) Process Flow

2-37

2.7

iTSV Versus pTSV Cost Of Ownership

2-38

2.8

Effect Of TSV Depth And Diameter On Cost

2-39

2.9

Illustration Of Bosch Process

2-43

2.10

Process And Equipment Flow For EMC3D Consortium Members

2-47

2.11

Various  TSV Integration Schemes

2-49

2.12

Forecast OF TSV Devices By Wafers

2-54

3.1

Operation of LED

3-41

3.2

Market drivers for LED Biz and Applications

3-45

3.3

SSL vs. Classical Technologies

3-46

3.4

LED Performance vs. Traditional Light Sources

3-47

3.5

Pareto Analysis Of SSL Manufacturing Costs

3-52

3.6

Nanoimprint Lithography System

3-60

3.7

Regular LED (white) Front-End Steps

3-63

3.8

Schematic of AMOLED

3-69

3.9

Active Matrix OLED Capacity and Demand Forecast

3-70

3.10

LED Market by Sector

3-81

3.11

Worldwide LED Market Forecast

3-82

3.12

Schematic of GaAs MESFET  

3-84

3.13

Schematic of GaAs HEMT Device  

3-86

3.14

Schematic of GaAs HBT Device  

3-89

3.15

Schematic of GaAs HBT Device  

3-91

3.16

pHEMT MMIC Process Flow Chart

3-93

3.17

0.15 Micron 3MI Process Cross Section

3-99

3.18

InGaP HBT Process

3-102

3.19

Worldwide SiGe Market Forecast

3-115

3.20

Hard Disk Drive Roadmap

3-118

3.21

Decrease In Average Price Of Storage

3-119

3.22

Heads Per Drive

3-121

3.23

Increase In Areal Density

3-123

3.24

Market Forecast Of Recording Head Consumption

3-127

3.25

Heads Per Drive Forecast

3-128

3.26

Thin Film Head Structure

3-130

3.27

Critical Features In Thin Film Head Structure

3-131

3.28

Spin Valve  Head Structure

3-132

3.29

Cross-Sectional View TFH Stacks

3-135

3.30

Cross-Sectional View Of A TFH Design

3-136

3.31

CMP Slurry System For Tfh Wafer Polishing

3-143

3.32

Critical Feature Trends In Thin Film Heads

3-146

3.33

Application Space For Rf Filters

3-149

3.34

FBAR Diagram

3-151

3.35

BAW-SMR Diagram

3-152

3.36

Worldwide BAW Forecast

3-159