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The Global MEMS Device, Equipment, and Materials Markets: Forecasts and Strategies for Vendors and Foundries

 

Table of Contents

 

Chapter 1

Introduction

1-1

 

 

 

Chapter 2

Forecast Of The Key Applications And Markets

2-1

 

 

 

2.1

MEMS Device Market Forecast

2-1

 

 

 

2.1.1

Ink Jet Head

2-4

2.1.2

Pressure Sensor

2-7

2.1.3

Silicon Microphone

2-15

2.1.4

Accelerometer

2-19

2.1.5

Gyroscope

2-22

2.1.6

MOEMS

2-25

2.1.7

Micro Display

2-28

2.1.8

Microfluidics

2-31

2.1.9

RF MEMS

2-33

2.1.10

Micro Fuel Cells

2-36

2.1.11

Emerging Applications

2-38

2.2

MEMS System Market Forecast

2-41

 

 

 

Chapter 3

Markets for Equipment and Materials Suppliers

1-1

 

 

 

3.1

Introduction

1-1

3.2

MEMS Equipment Markets

1-2

3.2.1

Assembly

1-4

3.2.2

Bonding

1-7

3.2.3

Cleaning

1-10

3.2.4

Deposition

1-12

3.2.5

Dicing

1-18

3.2.6

Etching

1-20

3.2.7

Laser Micromachining

1-26

3.2.8

Lithography

1-31

3.2.9

Metrology/Inspection

1-36

3.2.10

Testing

1-39

3.2.11

Thermal Treatment

1-42

3.2.12

Wafer Thinning

1-44

3.3

MEMS Material Markets

1-47

3.3.1

Chemicals

1-47

3.3.2

Photomasks

1-50

3.3.3

Substrates

1-53

 

 

 

Chapter 4

MEMS Foundries

4-1

 

 

 

4.1

Foundry Profiles and Strategies

4-1

4.1.1

Advanced Custom Sensors, Inc.

4-3

4.1.2

Advanced Microsensors

4-3

4.1.3

ACSI

4-4

4.1.4

Alpha Tech International

4-4

4.1.5

Amkor

4-5

4.1.6

APM

4-5

4.1.7

Applied MEMS

4-6

4.1.8

Asia Pacific Microsystems

4-6

4.1.9

Beijing First MEMS

4-7

4.1.10

Bosch

4-7

4.1.11

Branchy

4-8

4.1.12

China Resoources Semiconductor

4-8

4.1.13

Canadian Microelectronics Corporation (CMC)

4-9

4.1.14

Chipsense

4-9

4.1.15

Colibrys

4-10

4.1.16

Corning Intellisense

4-10

4.1.17

Cronos (subsidiary of MEMSCAP)

4-11

4.1.18

C2V

4-11

4.1.19

Dalsa

4-12

4.1.20

Delphi Delco

4-12

4.1.21

Dai-Nippon

4-13

4.1.22

ELMOS

4-13

4.1.23

ELume Inc.

4-14

4.1.24

Haleos

4-14

4.1.25

Honeywell MEMSplus

4-15

4.1.26

Infineon Technologies SensoNor As

4-15

4.1.27

Institute of Microelectronics

4-16

4.1.28

Innovative Micro Tech

4-16

4.1.29

Integrated Sensing Systems Inc. (ISSYS)

4-17

4.1.30

Intelligent Micro Patterning

4-17

4.1.31

Jazz Semiconductor

4-18

4.1.32

Kionix, New York

4-18

4.1.33

LioniX

4-19

4.1.34

MEMS Engineering and Material

4-19

4.1.35

MEMSCAP

4-20

4.1.36

MEMSIC

4-20

4.1.37

MEMS OpticalMEMStech

4-21

4.1.38

Metrodyne

4-21

4.1.39

MicralynemicroFAB Bremen GmbH

4-22

4.1.40

Micronit Microfluidics BV

4-22

4.1.41

Microbase

4-23

4.1.42

Midwest MicroDevices, LLC

4-23

4.1.43

MOSIS

4-24

4.1.44

Nanostructures Inc

4-24

4.1.45

NetMotion, Inc.

4-25

4.1.46

Norcada Inc.

4-25

4.1.47

Olympus Optical

4-26

4.1.48

Omron

4-26

4.1.49

OptiSwitch Technology Corp. (OTC)

4-27

4.1.50

Prodeo Technologies Inc

4-27

4.1.51

Protochips, Inc.

4-28

4.1.52

Proton Mikrotechnik

4-28

4.1.53

Rogue Valley Microdevices

4-29

4.1.54

SEMEFAB

4-29

4.1.55

Semiconductor Complex Limited

4-30

4.1.56

Sanyo

4-30

4.1.57

Silex Microsystems

4-31

4.1.58

SiWave, Inc.

4-31

4.1.59

Sony

4-32

4.1.60

Sporian, Colorado STMicroelectronics

4-32

4.1.61

SVTC Technologies

4-33

4.1.62

Taiwan Semiconductor Manufacturing Co Ltd (TSMC)

4-33

4.1.63

Touch Microsystems

4-34

4.1.64

TRONICS Microsystems

4-34

4.1.65

TI

4-35

4.1.66

Verimetra

4-35

4.1.67

Walsin Lihwa

4-36

4.1.68

X-Fab

4-36

4.1.69

Yokogawa

4-37

4.2

Segmentation of MEMS foundries

4-38

 

 

 

Chapter 5

Factors for Foundry Success

5-1

 

 

 

5.1.1

Achieving Economies Of Scale

5-1

5.1.2

Competitive Advantages

5-2

5.1.3

Core Strengths

5-3

5.1.4

Employee Commitment

5-3

5.1.5

Expansion Plans

5-3

5.1.6

Financial Objectives:

5-4

5.1.7

Groundbreaking MEMS Solutions

5-4

5.1.8

In- House Expertise in MEMS Testing And Reliability

5-4

5.1.9

Leadership in Technology

5-5

5.1.10

1Manufacturing Excellence

5-5

5.1.11

Manufacturing Process

5-5

5.1.12

Mastering Process and Production Technology

5-6

5.1.13

Patent Protection

5-7

5.1.14

Partnerships

5-7

5.1.15

Products

5-7

5.1.16

Proprietary Development Processes

5-8

5.1.17

Sales Organization

5-9

5.1.18

Sales Process and Customer Base

5-9

5.1.19

Strong Customer Relations

5-9

5.1.20

Vision and Goal

5-10

 

 

 

Chapter 6

Critical MEMS Issues

6-1

 

 

 

6.1

3-D Interconnects and Packaging

6-1

6.2

Wafer Size

6-11

6.3

MEMS Testing

6-14

6.4

Opportunities For Fabless MEMS Companies

6-18

 

 

LIST OF TABLES

 

 

2.1

Ink Jet Head Sales Forecast

2-6

2.2

Pressure Sensor Sales Forecast

2-10

2.3

Automotive Inertial Sensors Sales Forecast

2-11

2.4

Automotive Pressure Sensors Sales Forecast

2-12

2.5

Automotive Flow Sensors Sales Forecast

2-13

2.6

Automotive IR Sensors Sales Forecast

2-14

2.7

Silicon Microphone Sales Forecast

2-18

2.8

Accelerometer Sales Forecast

2-21

2.9

Gyroscope Sales Forecast

2-24

2.10

MOEMS Sales Forecast

2-27

2.11

Micro Display Sales Forecast

2-30

2.12

Microfluidics Sales Forecast

2-32

2.13

RF MEMS Sales Forecast

2-35

2.14

Micro Fuel Cells Sales Forecast

2-37

2.15

Emerging Applications Sales Forecast

2-40

3.1

Assembly Equipment Sales Forecast

3-6

3.2

Bonding Equipment Sales Forecast

3-9

3.3

Cleaning Equipment Sales Forecast

3-11

3.4

Deposition Equipment Sales Forecast

3-17

3.5

Dicing Equipment Sales Forecast

3-19

3.6

Etching Equipment Sales Forecast

3-25

3.7

Laser Micromachining Equipment Sales Forecast

3-30

3.8

Lithography Equipment Sales Forecast

3-35

3.9

Metrology/Inspection Equipment Sales Forecast

3-38

3.10

Testing Equipment Sales Forecast

3-41

3.11

Thermal Treatment Equipment Sales Forecast

3-43

3.12

Wafer Thinning Equipment Sales Forecast

3-46

3.13

Chemicals Sales Forecast

3-49

3.14

Photomasks Sales Forecast

3-52

3.15

Substrates Sales Forecast

3-54

4.1

Ranking Of Top MEMS Foundries

4-2

6.1

Forecast of Wafer Size

6-13

 

 

 

LIST OF FIGURES

 

 

 

2.1

MEMS Markets

2-2

2.2

MEMS System Sales Forecast

2-45

3.1

Discrete Assembly of MEMS

4-4

6-1

Process For Capping Mems

6-5

6-2

Examples Of Thermoplastic Cavity Packages

6-6

6-3

Fluidic Packaging System

6-8