High-Density Packaging (MCM, MCP, SIP):

Market Analysis and Technology Trends

TABLE OF CONTENTS

Chapter 1 

Introduction

1-1

Chapter 2 

Executive Summary

2-1

2.1

Summary of Technology Issues

2-1

2.2

Summary of Market Forecasts

2-5

Chapter 3 

Technology Issues and Trends

3-1

3.1

Overview of MCM Technology

3-1

3.1.1

Need for Multiple IC Integration

3-5

3.1.2

Challenges of Multiple IC Integration

3-10

3.2

Technical Constraints of Integration

3-11

3.3

Economic Benefits of MCMs

3-14

3.4

Technology Issues

3-18

3.4.1

Substrates

3-18

3.4.2

Conductors

3-31

3.4.3

Dielectrics

3-41

3.4.4

Vias

3-43

3.4.5

Die Attachment

3-46

3.4.6

Next Level Interconnection

3-56

3.4.7

Thermal Management

3-59

3.4.8

Test and Inspection

3-60

3.4.9

Design

3-67

3.5

3-D Modules

3-73

3.6

Superconducting Interconnects

3-76

3.7

Known Good Die

3-77

3.8

System on a Package (SOP)

3-78

Chapter 4 

Applications

4-1

4.1

Overview of MCM Applications

4-1

4.2

Military and Aerospace

4-2

4.3

Computer and Peripheral Equipment

4-6

4.4

Communications

4-9

4.5

Consumer

4-12

4.6

Industrial

4-14

Chapter 5 

Competitive Environment

5-1

5.1

Overview of the MCM Competitive Environment

5-1

5.2

Joint Ventures and Cooperative Agreements

5-6

5.3

MCM Manufacturers

5-8

o

Advanced Packaging Systems

5-10

o

Aeroflex Laboratories

5-11

o

Amkor Electronics

5-11

o

Analog Devices

5-12

o

Appian Technology

5-13

o

Ceramic Packaging

5-14

o

Conexant

5-14

o

Control Data

5-15

o

CTM Electronics

5-15

o

CTS

5-15

o

David Sarnoff Research Center

5-16

o

Delphi Delco

5-16

o

Digital Equipment

5-17

o

Elpaq

5-17

o

ERIM

5-18

o

Eureka

5-18

o

Fujitsu

5-19

o

GEC Plessey

5-20

o

General Electric

5-21

o

Hadco

5-22

o

Honeywell

5-23

o

Hughes

5-24

o

Ibiden

5-24

o

IBM

5-25

o

ILC Data Device Corp.

5-29

o

Infineon

5-30

o

Interconnect Systems

5-30

o

Interconnex

5-31

o

International Micro Industries

5-31

o

Integrated System Assemblies

5-32

o

Intersil

5-33

o

Kodak

5-33

o

Kyocera

5-34

o

Lexmark International

5-34

o

Lucent Technologies

5-35

o

MicroModule Systems

5-37

o

Mitsubishi

5-39

o

Motorola

5-39

o

nCHIP

5-40

o

NEC

5-41

o

Pacific Microelectronics

5-42

o

Pacific Microelectronics Centre

5-42

o

Packard-Hughes Interconnect

5-43

o

Panda Project

5-44

o

Phillips Laboratory

5-44

o

Philips

5-46

o

Pico Systems

5-46

o

Quadrant Technology

5-47

o

RISH

5-47

o

Rockwell Avionics

5-48

o

Rogers

5-48

o

S3

5-49

o

Sheldahl

5-49

o

Shinko

5-51

o

S-MOS Systems

5-51

o

Spectra

5-52

o

Tektronix

5-52

o

Teledyne Electronic Technologies

5-53

o

Texas Instruments

5-54

o

Thomson Consumer Electronics

5-57

o

Toshiba

5-58

o

TRW

5-58

o

United Technologies

5-59

o

White Electronic Designs

5-59

o

W.L. Gore & Associates

5-59

o

Z Systems

5-60

Chapter 6 

Market Forecast

6-1

6.1

Overview of Multichip Modules

6-1

6.2

Driving Forces

6-5

6.3

Worldwide IC Market Forecast

6-7

6.4

Worldwide Packaging Market Forecast

6-7

6.5

Worldwide MCM Market Forecast

6-10

6.6.1

Worldwide Forecast By Substrate Type

6-15

6.6.2

Market Forecast By Application

6-19

Chapter 7 

3-D Packaging

7-1

7.1

Introduction

7-1

7.2 

Interconnect Usability and Accessibility

7-7

7.3 

Noise

7-11

7.4 

Power Consumption

7-12

7.5 

Vertical Interconnections in 3D Electronics

7-13

7.5.1 

Stacked Tape Carrier

7-13

7.5.2 

Solder Edge Conductors

7-15

7.5.3 

Thin Film Conductors on Face-of-a-Cube

7-17

7.5.4

 An Interconnection Substrate Soldered to the Cube Face

7-20

7.5.5 

Folded Flex Circuits

7-20

7.5.6 

Wire Bonded Stacked Chips

7-24

7.6 

Area Interconnection between Stacked MCMs

7-27

7.6.1 

Arrays of Contacts between MCMs With Through Hole Vias

7-27

7.7 

Limitations of 3D Packaging Technology

7-31

7.7.1

Thermal Management

7-31

7.7.2 

Cost

7-31

7.7.3 

Design complexity

7-32

7.7.4 

Time to Delivery

7-34

LIST OF TABLES