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High-Density Packaging (MCM, MCP, SIP): Market
Analysis and Technology Trends
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TABLE OF CONTENTS |
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Chapter 1 |
Introduction |
1-1 |
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Chapter 2 |
Executive Summary |
2-1 |
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2.1 |
Summary of Technology Issues |
2-1 |
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2.2 |
Summary of Market Forecasts |
2-5 |
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Chapter 3 |
Technology Issues and
Trends |
3-1 |
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3.1 |
Overview of MCM Technology |
3-1 |
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3.1.1 |
Need for Multiple IC
Integration |
3-5 |
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3.1.2 |
Challenges of Multiple IC
Integration |
3-10 |
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3.2 |
Technical Constraints of
Integration |
3-11 |
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3.3 |
Economic Benefits of MCMs |
3-14 |
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3.4 |
Technology Issues |
3-18 |
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3.4.1 |
Substrates |
3-18 |
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3.4.2 |
Conductors |
3-31 |
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3.4.3 |
Dielectrics |
3-41 |
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3.4.4 |
Vias |
3-43 |
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3.4.5 |
Die Attachment |
3-46 |
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3.4.6 |
Next Level Interconnection |
3-56 |
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3.4.7 |
Thermal Management |
3-59 |
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3.4.8 |
Test and Inspection |
3-60 |
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3.4.9 |
Design |
3-67 |
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3.5 |
3-D Modules |
3-73 |
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3.6 |
Superconducting Interconnects |
3-76 |
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3.7 |
Known Good Die |
3-77 |
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3.8 |
System on a Package (SOP) |
3-78 |
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Chapter 4 |
Applications |
4-1 |
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4.1 |
Overview of MCM Applications |
4-1 |
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4.2 |
Military and Aerospace |
4-2 |
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4.3 |
Computer and Peripheral
Equipment |
4-6 |
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4.4 |
Communications |
4-9 |
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4.5 |
Consumer |
4-12 |
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4.6 |
Industrial |
4-14 |
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Chapter 5 |
Competitive Environment |
5-1 |
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5.1 |
Overview of the MCM
Competitive Environment |
5-1 |
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5.2 |
Joint Ventures and Cooperative
Agreements |
5-6 |
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5.3 |
MCM Manufacturers |
5-8 |
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Advanced Packaging Systems |
5-10 |
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Aeroflex Laboratories |
5-11 |
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Amkor Electronics |
5-11 |
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Analog Devices |
5-12 |
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Appian Technology |
5-13 |
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Ceramic Packaging |
5-14 |
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Conexant |
5-14 |
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Control Data |
5-15 |
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CTM Electronics |
5-15 |
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CTS |
5-15 |
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David Sarnoff Research Center |
5-16 |
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Delphi Delco |
5-16 |
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Digital Equipment |
5-17 |
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Elpaq |
5-17 |
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ERIM |
5-18 |
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Eureka |
5-18 |
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Fujitsu |
5-19 |
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GEC Plessey |
5-20 |
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General Electric |
5-21 |
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Hadco |
5-22 |
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Honeywell |
5-23 |
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Hughes |
5-24 |
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Ibiden |
5-24 |
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IBM |
5-25 |
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ILC Data Device Corp. |
5-29 |
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Infineon |
5-30 |
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o |
Interconnect Systems |
5-30 |
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Interconnex |
5-31 |
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International Micro Industries |
5-31 |
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o |
Integrated System Assemblies |
5-32 |
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Intersil |
5-33 |
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Kodak |
5-33 |
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Kyocera |
5-34 |
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Lexmark International |
5-34 |
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Lucent Technologies |
5-35 |
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o |
MicroModule Systems |
5-37 |
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Mitsubishi |
5-39 |
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Motorola |
5-39 |
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nCHIP |
5-40 |
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NEC |
5-41 |
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Pacific Microelectronics |
5-42 |
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Pacific Microelectronics
Centre |
5-42 |
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Packard-Hughes Interconnect |
5-43 |
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Panda Project |
5-44 |
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Phillips Laboratory |
5-44 |
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Philips |
5-46 |
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Pico Systems |
5-46 |
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Quadrant Technology |
5-47 |
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RISH |
5-47 |
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Rockwell Avionics |
5-48 |
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Rogers |
5-48 |
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S3 |
5-49 |
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Sheldahl |
5-49 |
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Shinko |
5-51 |
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S-MOS Systems |
5-51 |
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Spectra |
5-52 |
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Tektronix |
5-52 |
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Teledyne Electronic Technologies |
5-53 |
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Texas Instruments |
5-54 |
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Thomson Consumer Electronics |
5-57 |
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Toshiba |
5-58 |
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TRW |
5-58 |
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United Technologies |
5-59 |
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White Electronic Designs |
5-59 |
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W.L. Gore & Associates |
5-59 |
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Z Systems |
5-60 |
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Chapter 6 |
Market Forecast |
6-1 |
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6.1 |
Overview of Multichip Modules |
6-1 |
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6.2 |
Driving Forces |
6-5 |
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6.3 |
Worldwide IC Market Forecast |
6-7 |
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6.4 |
Worldwide Packaging Market
Forecast |
6-7 |
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6.5 |
Worldwide MCM Market Forecast |
6-10 |
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6.6.1 |
Worldwide Forecast By
Substrate Type |
6-15 |
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6.6.2 |
Market Forecast By Application |
6-19 |
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Chapter 7 |
3-D Packaging |
7-1 |
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7.1 |
Introduction |
7-1 |
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7.2 |
Interconnect Usability and Accessibility |
7-7 |
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7.3 |
Noise |
7-11 |
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7.4 |
Power Consumption |
7-12 |
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7.5 |
Vertical Interconnections in 3D Electronics |
7-13 |
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7.5.1 |
Stacked Tape Carrier |
7-13 |
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7.5.2 |
Solder Edge Conductors |
7-15 |
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7.5.3 |
Thin Film Conductors on Face-of-a-Cube |
7-17 |
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7.5.4 |
An
Interconnection Substrate Soldered to the Cube Face |
7-20 |
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7.5.5 |
Folded Flex Circuits |
7-20 |
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7.5.6 |
Wire Bonded Stacked Chips |
7-24 |
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7.6 |
Area Interconnection between Stacked MCMs |
7-27 |
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7.6.1 |
Arrays of Contacts between MCMs With Through Hole Vias |
7-27 |
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7.7 |
Limitations of 3D Packaging Technology |
7-31 |
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7.7.1 |
Thermal Management |
7-31 |
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7.7.2 |
Cost |
7-31 |
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7.7.3 |
Design complexity |
7-32 |
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7.7.4 |
Time to Delivery |
7-34 |
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LIST
OF TABLES
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