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Mask
Making, Inspection, & Repair: Market
Analysis and Strategic Issues |
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TABLE OF CONTENTS |
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Chapter
1 |
Introduction
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1-1 |
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1.1 |
The
Need For This Report |
1-1 |
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Chapter
2 |
Executive
Summary |
2-1 |
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2.1 |
Summary
of Major Issues |
2-1 |
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2.2 |
Summary
of Market Opportunities |
2-3 |
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Chapter
3 |
Technology
Issues |
3-1 |
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3.1 |
Mask
Making |
3-1 |
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3.1.1 |
Mask
Blanks |
3-1 |
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3.1.2 |
Completed
Masks |
3-4 |
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3.2 |
Mask
Making Equipment |
3-18 |
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3.2.1 |
Electron
Beam Systems |
3-18 |
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3.2.2 |
Laser
Pattern Generators |
3-24 |
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3.3 |
Mask
Inspection |
3-30 |
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3.3.1 |
Mask
Defects |
3-36 |
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o |
Transmission
Variations |
3-36 |
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o |
Transparent
Defects |
3-36 |
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o |
Nuisance
Defects |
3-37 |
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o |
CD
Variations |
3-37 |
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o |
Reflectivity
Variations |
3-38 |
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3.4 |
Mask
Repair |
3-40 |
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3.4.1 |
Laser
Repair |
3-43 |
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3.4.2 |
Focused
Ion Beam Repair |
3-44 |
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3.4.3 |
Other
Repair Methods |
3-48 |
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Chapter
4 |
User
- Vendor Strategies |
4-1 |
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4.1 |
Establishing
User Needs |
4-1 |
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4.1.1 |
Mask
Making - Merchant or Captive |
4-1 |
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4.1.2 |
Submicron
Mask Making Equipment - Laser vs E-Beam |
4-5 |
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4.1.3 |
Mask
Inspection Equipment |
4-6 |
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4.1.4 |
Mask
Repair - Laser vs FIB |
4-7 |
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4.1.5 |
Phase-Shift
Masks |
4-10 |
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4.1.6 |
Optical
Proximity Correction |
4-21 |
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4.1.7 |
NGL
Technology Challenges |
4-24 |
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4.1.7.1
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X-Ray
Masks |
4-31 |
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4.1.7.2
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EPL
Masks |
4-39 |
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4.1.7.3
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EUVL
Masks |
4-40 |
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4.2 |
Competitive
Vendor Strategies |
4-41 |
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Chapter
5 |
Market
Forecast |
5-1 |
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5.1 |
Driving
Forces |
5-1 |
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5.1.1 |
Introduction |
5-1 |
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5.1.2 |
Trends
in IC Processing Technology |
5-5 |
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5.1.3
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Mask
and Reticle Requirements |
5-9 |
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5.1.4 |
Fast
Turnaround Devices |
5-9 |
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5.1.5 |
Impact
of Direct Write E-Beam and X-Ray |
5-17 |
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5.2 |
Market
Forecast Assumptions |
5-18 |
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5.3 |
Mask
Making, Inspection, and Repair |
5-19 |
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5.3.1 |
Completed
Mask Market |
5-19 |
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5.3.2 |
Reticle/Mask
Manufacturing Equipment |
5-34 |
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LIST OF FIGURES |
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3.1 |
Light
Transmittance of Glasses |
3-2 |
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3.2 |
Photomask
Fabrication Flow |
3-7 |
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3.3 |
Optical
Photomask Fabrication Flow |
3-8 |
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3.4 |
SCAPLEL
Photomask Fabrication Flow |
3-9 |
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3.5 |
MaskRigger
Software in a Mask Fabrication Process
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3-21 |
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3.6 |
Schematic
of a Laser Pattern Generator |
3-25 |
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3.7 |
Mulith
Reference Distribution Aerial Image Formation |
3-29 |
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3.8 |
Die-to-Die
and Die-to-Database Inspection |
3-31 |
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3.9 |
Defect
Inspection Practices |
3-32 |
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3.10 |
Percentage
of Yield Losses |
3-39 |
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3.11 |
Yield
for Binary Masks |
3-41 |
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3.12 |
Yield
for PSM Masks |
3-42 |
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3.13
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Schematic
of a Focused Ion Beam System |
3-45 |
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3.14
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Illustration
of Clear and Opaque Mask Repair |
3-47 |
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4.1 |
Throughput
of Alta 3000 Laser Versus Alta 3000 HT Systems |
4-5 |
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4.2 |
Subwavelength
Gap |
4-12 |
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4.3 |
Lithography
Requirements |
4-14 |
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4.4 |
Phase-Shifting
Masks |
4-15 |
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4.5 |
iN
Phase Mask Design |
4-18 |
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4.6 |
Illustration
of OPC |
4-22 |
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4.7 |
Main
NGL Mask Formats |
4-26 |
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4.8 |
Mask
Costs Versus Feature Size |
4-36 |
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5.1 |
Production
Costs for Maskmaking |
5-11 |
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5.2 |
Capital
Expenditures and Revenues |
5-12 |
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5.3 |
Photomask
Functionality |
5-13 |
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5.4 |
Worldwide
Merchant Mask Making Market Shares |
5-26 |
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5.5 |
North
American Merchant Mask Making Market Shares |
5-27 |
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5.6 |
European
Merchant Mask Making Market Shares |
5-28 |
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5.7 |
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5-29 |
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5.8 |
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5-30 |
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5.9 |
Worldwide
Mask Making Equipment Market Shares |
5-38 |
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LIST OF TABLES |
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4.1 |
FIB
and Laser Repair Comparison |
4-8 |
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4.3 |
NGL
Mask Formats |
4-35 |
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4.4 |
Cost
of Reticle/X-Ray Mask |
4-41 |
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4.5 |
Phase
Shift Mask and X-Ray Mask Manufacturing |
4-44 |
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5.1 |
Overall
Roadmap of Technology Characteristics |
5-6 |
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5.2 |
Roadmap
of Mask Inspection |
5-7 |
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5.3 |
IC
Lithographic Requirements |
5-8 |
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5.4 |
Increasing
Mask COmplexity |
5-10 |
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5.5 |
Worldwide
Mask Making Market by Feature Size |
5-24 |
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5.6
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Captive
Mask Shops |
5-32 |
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5.7
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Worldwide
Mask Making Equipment Market Forecast |
5-36 |
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5.8
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Worldwide
Mask Making Equipment Market Shares |
5-37 |
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5.9
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Mask
Inspection Market Forecast |
5-40 |