Sub-100 nm Lithography: Market

Analysis and Strategic Issues

TABLE OF CONTENTS

Chapter 1 

Introduction

1-1

1.1

The Need For This Report

1-1

Chapter 2 

Executive Summary

2-1

2.1

Summary of Major Issues

2-1

2.2

Summary of Market Opportunities

2-4

Chapter 3 

Lithography Issues And Trends

3-1

3.1

Optical Systems

3-1

3.1.1

Scanning Projection Aligners

3-5

3.1.2

Step-and-Repeat Aligners

3-14

3.1.3

248nm DUV Resist

3-31

3.1.4

193nm DUV Resist

3-33

3.1.5

Mix-and-Match

3-36

3.1.6

157nm DUV And Resist

3-37

3.1.7

EUV

3-42

3.2

X-Ray Systems

3-46

3.2.1

X-Ray Sources

3-46

3.2.2

X-Ray Masks

3-51

3.2.3

X-Ray Steppers

3-53

3.2.4

X-Ray Resists

3-54

3.3

Electron Beam Systems

3-55

3.4

Ion Beam Systems

3-62

3.4.1

Direct Write

3-62

3.4.2

Ion Channel Masking

3-63

3.4.3

Ion Projection

3-63

3.5

New Technologies

3-65

3.5.1

Mulith Reference Distribution Aerial Image Formation

3-65

3.5.2

Holograms

3-71

3.5.3

X-Ray Laser

3-71

3.5.4

Atom Lithography

3-71

3.5.5

Microlenses

3-75

3.5.6

Nano-Imprint Lithography

3-80

3.6

Evaluation of Lithography Cost of Ownership

3-83

3.6.1

Introduction

3-83

3.6.2

Cost of Ownership Model

3-83

3.6.3

Results of Cost of Ownership Calculation

3-86

3.6.4

Individual Cost Estimation

3-93

o 

Lithography System Cost

3-93

o 

Process Costs

3-98

o 

Mask Costs

3-99

3.6.5

Conclusion

3-104

3.7

Lithography System Pros and Cons

3-106

Chapter 4 

User - Supplier Strategies

4-1

4.1

Determining Lithography Needs

4-1

4.2

Benchmarking a Vendor

4-3

4.2.1

Pricing

4-3

4.2.2

Vendor Commitment and Attitudes

4-5

4.2.3

Vendor Capabilities

4-7

4.2.4

System Capabilities

4-9

4.2.5

Vendor Feedback During Equipment Evaluation

4-9

4.2.6

Vendor Feedback During Device Production

4-11

4.3

Competitive Environment

4-12

4.4

Equipment For Class 1 Cleanrooms

4-15

4.5

Equipment For the Factory of the Future

4-18

4.6

Opportunities

4-19

Chapter 5 

Market Forecast

5-1

5.1

Driving Forces

5-1

5.1.1

Technical Trends

5-3

5.1.2

Economic Trends

5-8

5.1.3

Optical Limitations

5-12

5.2

Market Forecast Assumptions

5-13

5.3

Market Forecast

5-14

LIST OF FIGURES

1.1

Lithographic Equipment Requirements for DRAMs

1-2

3.1 

Lithography Roadmap

3-6

3.2

Lens Arrangement For Submicron Features

3-18

3.3

EUV Lithography

3-43

3.4

Illustration of X-Ray Lithography

3-49

3.5

Schematic Of Scalpel Electron Beam System

3-56

3.6

Multi-Source E-Beam Lithography

3-58

3.7

Principles of LEEPL

3-61

3.8

Ion Projection Lithography System

3-64

3.9

Mulith Reference Distribution Aerial Image Formation

3-70

3.10

Schematic of Microlens

3-76

3.11

Mapper Mask-Based Lithography

3-78

3.12

Mapper Maskless Lithography

3-79

3.13

Nanoimprint Lithography Process

3-81

3.14

Nanoimprint Lithography Process

3-82

3.15

CoO Value in DRAM Mass Production

3-88

3.16

Lithography Costs for 40,000 Wafers/Mask

3-90

3.17

Lithography Costs for 1,000 Wafers/Mask

3-91

4.1

Manufacturing Costs Per Exposure Station

4-2

5.1

Lithography Market Vs Equipment Market

5-16

5.2

Lithography Requirements

5-19

5.3

Segmentation of Stepper/Scan Shipments

5-23

5.4

Market Shares of Vendors (Units)

5-24

5.5

Market Shares of Vendors

5-27

5.6

Market Shares of Vendors (Revenues)

5-28

LIST OF TABLES

3.1

Lithography Requirements for IC Production

3-16

3.2

Advanced Optical Lithography Scenarios

3-27

3.3

Lithography Requirements

3-29

3.4

Characteristics of X-Ray Systems

3-47

3.5

Basic Conditions of CoO Model

3-85

3.6

Calculation List of Lithography System Cost

3-95

3.7

Throughput Estimation of X-Ray Lithography

3-97

3.8

Cost of Reticle/X-Ray Mask

3-101

3.9

Phase Shift Mask and X-Ray Mask Manufacturing

3-103

4.1

Manufacturing Costs Per Exposure Station

4-2

5.1

Worldwide Capital Spending

5-9

5.2

DRAM Lithographic Requirements

5-11

5.3

Worldwide Stepper Market

5-21

5.4

Worldwide Stepper Market Shares

5-26