The GaAs IC Market

TABLE OF CONTENTS

Chapter 1 

Introduction

1-1

Chapter 2 

Executive Summary

2-1

2.1

Summary of Major Issues

2-1

2.2

Summary of Market Forecast  

2-7

Chapter 3 

Technology Issues

3-1

3.1

GaAs Devices 

3-1

3.1.1

FETs  

3-1

3.1.2

HEMTs 

3-3

3.1.3 

HBT

3-6

3.2 

Comparison of Logic Structures   

3-10

3.2.1 

Buffered FET Logic   

3-12

3.2.2 

FET Logic  

3-12

3.2.3 

Capacitively Enhanced Logic

3-15

3.2.4 

Direct-Coupled FET Logic  

3-15

3.2.5 

Source-Coupled FET Logic  

3-17

3.3

Material Issues   

3-20

3.3.1

Wafer Production   

3-20

3.3.2

Etch Pit Densities   

3-26

3.4

Equipment

3-27

3.4.1 

Implanters 

3-35

3.4.2 

Lithography

3-35

3.4.3 

Etching

3-36

3.4.4 

Deposition 

3-38

3.4.5

Rapid Thermal Processing

3-38

3.5

Packaging

3-39

3.5.1 

Package Types   

3-39

3.5.2 

Bonding

3-42

3.6

Testing 

3-46

3.7 

Design  

3-48

Chapter 4 

Applications for GaAs ICs

4-1

4.1

Introduction

4-1

4.1.1

The Trend Toward Higher Frequencies

4-4

4.1.2

Transition from Analog to Digital Modulation

4-5

4.1.3

Discrete Components and Silicon-Based ICs

4-6

4.2

Markets

4-8

4.2.1

Telecommunications Systems

4-8

4.2.2

Wireless Communications Market

4-10

4.2.3

Television Systems

4-14

4.2.4

Computing

4-15

4.2.5

Data Communications

4-16

4.2.6

Automated Test Equipment

4-18

Chapter 5 

IC Supplier and End-User Issues

5-1

5.1 

Introduction 

5-1

5.2

Competing Against Silicon

5-3

5.3

Competing Against The Japanese   

5-13

5.4

Taiwan’s Market Momentum

5-14

5.5

Korea’s Market Momentum

5-20

5.6

Wafer Sizes

5-30

5.7

Competing Against SiGe

5-34

5.7.1

Introduction

5-34

5.7.2

Technology

5-39

5.7.2.1 

Strained Silicon

5-40

5.7.2.2 

Device Manufacturing

5-43

5.7.3

Applications

5-49

5.7.3.1 

OC-192

5-50

5.7.3.2 

OC-768

5-52

5.7.3.3 

Bluetooth

5-53

5.7.3.4 

Other SiGe Actvities

5-54

Chapter 6 

Market Forecast

6-1

6.1

Driving Forces

6-1

6.2

Market Forecast Assumptions 

6-5  

6.3 

GaAs IC Market Forecast

6-6

6.4 

SiGe IC Market Forecast

6-15

6.4

End Application Market

6-17

Chapter 7

Profile of GaAs IC Manufacturers

7-1

LIST OF FIGURES

3.1

Schematic of GaAs MESFET  

3-2

3.2

Schematic of GaAs HEMT Device  

3-4

3.3

Schematic of GaAs HBT Device  

3-8

3.4

Schematic of GaAs HBT Device  

3-9

3.5

Symbolic Representations of Various GaAs Transistor Type

3-11

3.6

Schematic of BFL Logic Gate

3-13

3.7

Schematic of FETL Logic Gate   

3-14

3.8

Schematic of CEL Logic Gate

3-16

3.9

Schematic of DCFL Logic Gate   

3-18

3.10

Schematic of SCFL Logic Gate   

3-19

3.11

GaAs on Si Structure 

3-23

3.12

GaAs on Si Structure 

3-25

3.13

pHEMT MMIC Process Flow Chart

3-29

5.1

Comparison of Die Costs of Si and GaAs

5-4

5.2

Strained Silicon on Silicon Germanium

5-42

6.1

Worldwide Merchant GaAs IC Market Forecast By Device Type

6-8

6.2

Worldwide GaAs Merchant Market Forecast By Geographical Region

6-11

6.3

Worldwide GaAs Merchant Market Forecast By Application  

6-13

6.4

Worldwide SiGe Market Forecast

6-16

LIST OF TABLES

5.1

Cost Comparison for GaAs Structures

5-6

6.1

Worldwide Merchant GaAs IC Market Forecast By Device Type

6-7

6.2

Worldwide Merchant Market Forecast By Geographical Region

6-10

6.3

Worldwide Merchant Market Forecast By Application  

6-12

6.4

Market Shares of U.S. Merchant Participants

6-14