Cluster Tools In IC Processing:

Technology and Market Forecasts

TABLE OF CONTENTS

Chapter 1 

Introduction

1-1

Chapter 2 

Executive Summary

2-1

2.1

Summary of Technical Issues

2-1

2.2

Summary of Market Forecast

2-4

Chapter 3 

Interface Standards

3-1

3.1

SEMI/MESC

3-1

3.2

SECS I and SECS II

3-8

3.3

High-Speed Secs Message Services (HSMS) Standard

3-12

3.4

GEM

3-14

3.5

Standards Directions

3-15

Chapter 4 

The Cluster Concept

4-1

4.1

Definitions

4-1

4.2

Device Technology and Integrated Processing

4-4

4.3

Main Functional Units

4-7

4.3.1

Central Handling Platform

4-7

4.3.2

Cassette Stations

4-7

4.3.3

Extension Modules

4-8

4.3.4

Single Process Modules

4-8

4.3.5

Batch Modules

4-8

4.3.6

Multiple Process Modules

4-9

4.4

Cluster Tool Communications

4-10

4.4.1

Cluster Tool Controller

4-13

4.4.2

Transport Module Controller

4-13

4.4.3

Process Module Controller

4-14

4.4.4

Control Software

4-14

4.4.5

Human Interface Software

4-15

4.4.6

Networking Software

4-16

4.5

Vacuum System Design

4-17

Chapter 5 

Commercial Cluster Tools

5-1

5.1

Cluster Tools and Suppliers

5-1

o

AIO

5-6

o

Alcatel

5-6

o

Anelva

5-7

o

Apex

5-9

o

Applied Materials

5-9

o

ASM America

5-14

o

ASML

5-19

o

Axcelis Technologies

5-20

o

BLE Laboratory Equipment

5-21

o

Brooks Automation

5-21

o

Convac-APT

5-25

o

Couger Labs

5-25

o

DaiNippon Screen

5-26

o

Ebara

5-27

o

FSI International

5-28

o

Genmark

5-29

o

Genus

5-30

o

Ginitech

5-34

o

Hitachi

5-35

o

IPS

5-37

o

Jipelec

5-34

o

Jusung Engineering

5-38

o

Kanematsu Semiconductor

5-40

o

Kokusai

5-40

o

Kornic

5-41

o

Lam Research

5-41

o

Mattson Technology

5-42

o

Matrix Integrated Systems

5-43

o

Modern Industries

5-43

o

Modular Process Technology

5-43

o

Novellus Systems

5-44

o

Oxford Plasma Technology

5-46

o

Peter Wolters

5-47

o

Rorze

5-47

o

Samsung Electronics

5-48

o

SC Fluids

5-49

o

Semitool

5-49

o

Sputtered Films  

5-50

o

Surface Technology Systems

5-53

o

Suss MicroTec AG

5-54

o

Tek-Vac

5-54

o

Tegal

5-56

o

Thermo Electron Corp.

5-59

o

Tokyo Electron

5-59

o

Trikon Technologies

5-61

o

Ulvac

5-64

o

Unaxis

5-65

o

Vactronics Lab Equipment

5-66

o

Veeco

5-69

5.2

Process Modules and Suppliers

5-70

o

AXIC

5-71

o

Nanaometrics

5-72

o

Nicolet

5-72

o

Nova Measuring Instruments

5-73

o

Pfeiffer Vacuum

5-74

o

XMR

5-75

Chapter 6 

Cluster Tool Process Trends

6-1

6.1

Introduction

6-1

6.2

Deposition - Plasma Etch

6-2

6.3

Deposition - Rapid Thermal Processing

6-3

6.4

Lithography - Resist Processing

6-4

6.5

Diagnostics - Process

6-5

6.6

CMP Polish - Clean

6-7

Chapter 7 

Cluster Tool Issues

7-1

7.1

Introduction

7-1

7.2

Equipment Reliability

7-2

7.3

Equipment Maintainability

7-2

7.4

Challenges

7-6

7.5

Opportunities

7-8

Chapter 8 

Economic and Human Resource Issues

8-1

8.1 

Introduction

8-1

8.2

Economic Justification

8-1

8.2.1

Background

8-1

8.2.2

Cost Justification

8-2

8.2.3

Reserves

8-4

8.2.4

Personnel Costs

8-4

8.2.5

Other ROI Considerations

8-4

8.3

Human Resources Impact

8-5

8.3.1

Background

8-5

8.3.2

Direct Labor

8-6

8.3.3

Equipment Support

8-7

8.3.4

Process Engineering

8-9

8.3.5

Operations Staff

8-10

Chapter 9 

Market Forecast

9-1

9.1

Introduction

9-1

9.1.1

Plasma Etching and Stripping

9-2

9.1.2

Thin Film Deposition

9-2

9.1.3

Lithography

9-3

9.1.4

Rapid Thermal Processing

9-4

9.1.5

Resist Processing

9-5

9.1.6

Thin Film Diagnostics

9-6

9.1.7

CMP

9-6

9.2

Market Forecast Assumptions

9-7

9.3

Market Forecast

9-8

9.3.1

Total Available Equipment Market

9-8

9.3.2

Flexible Cluster Tool Market

9-12

9.3.3

Non-Flexible Cluster Tool Market

9-15

9.3.4

Total Cluster Tool Market

9-18

LIST OF FIGURES

3.1

Trend in Use of SECS by Equipment Manufacturers

3-13

4.1

Basic Cluster Tool Architecture

4-2

4.2

Basic Cluster Tool Architecture

4-3

4.3

Communication Architecture in a Cluster Tool

4-11

5.1

Anelva’s Cu CVD Process Tool

5-8

5.2

Process Chambers in Applied Materials' EPI Centura System

5-13

5.3

Brooks Automation’s Gemini Express 8000

5-22

5.4

Process Chambers in Hitachi’s M600 Etcher

5-33

8.1

Segmentation of Operator Processing Functions

8-3

9.1

Shares of the Total Available Market

9-11

9.2

Market Forecast of Flexible Cluster Tools

9-13

9.3

Market Shares of Flexible Cluster Tools

9-14

9.4

Market Forecast of Non-Flexible Cluster Tools

9-16

9.5

Market Shares of Non-Flexible Cluster Tools

9-17

9.6

Cluster Tools vs Total Available Market - 2003

9-21

9.7

Cluster Tools vs Total Available Market - 2006

9-22

9.8

Cluster Tools as % of TAM 2003 and 2006

9-23

LIST OF TABLES

3.1

Corporate Participants in SEMI/MESC

3-3

4.1

Model for DRAM Production Line

4-5

9.1

Total Available Equipment Market Forecast

9-10

9.2

Total Cluster Tool Equipment Market Forecast

9-19