Cleanrooms and Contamination Control

in VLSI Manufacturing

TABLE OF CONTENTS

Chapter 1 

Introduction

1-1

1.1

The Need For This Report

1-1

Chapter 2 

Executive Summary

2-1

2.1

Summary of Major Findings

2-1

2.2

Summary of Market Forecast

2-3

Chapter 3 

Cleanroom Design

3-1

3.1

Types of Cleanrooms

3-1

3.2

Minienvironments

3-8

3.2.1

200mm

3-8

3.2.2

300mm

14

3.3

Airflow Filtering

3-17

3.4

Electrostatic Discharge

3-21

3.5

Impact of ASIC Devices

3-22

3.6

Impact of VLSI Devices

3-22

3.7

Impact of Factory Automation and 300-MM Wafers

3-24

Chapter 4 

Worldwide Semiconductor Fabs

4-1

4.1

North American Fabs

4-1

o

Company

o

Address

o

Size of Wafer Processed

o

Minimum Feature Size

o

Process Technology

o

Principle Products

o

Employees

o

Plant Area

o

Cleanroom Area

4.2

European Fabs

4-71

o

Company

o

Address

o

Size of Wafer Processed

o

Minimum Feature Size

o

Process Technology

o

Principle Products

o

Employees

o

Plant Area

o

Cleanroom Area

4.3

Japanese Fabs

4-106

o

Company

o

Address

o

Size of Wafer Processed

o

Minimum Feature Size

o

Process Technology

o

Principle Products

o

Employees

o

Cleanroom Area

4.4

Korean Fabs

4-130

o

Company

o

Address

o

Size of Wafer Processed

o

Minimum Feature Size

o

Process Technology

o

Principle Products

o

Employees

o

Cleanroom Area

o

Total Sales

4.5

Taiwan Fabs

4-133

o

Company

o

Address

o

Size of Wafer Processed

o

Minimum Feature Size

o

Process Technology

o

Principle Products

o

Employees

o

Cleanroom Area

4.6

ROW Fabs

4-142

o

Company

o

Address

o

Size of Wafer Processed

o

Minimum Feature Size

o

Process Technology

o

Principle Products

o

Employees

o

Cleanroom Area

Chapter 5 

Contamination Issues

5-1

5.1

Liquid Chemicals

5-1

5.1.1

Purification Methods

5-1

5.1.2

Particulates

5-3

o

Effects on Yield

5-3

o

Particulate Removal

5-5

o

Particle Monitoring

5-18

5.1.3

Bulk Distribution vs Bottles

5-20

5.1.4

Piping System Construction

5-21

o

Materials of Construction

5-21

o

Cost Analysis

5-22

5.2

Gases

5-25

5.2.1

Technology Issues

5-25

5.2.2

Requirements

5-27

o

Purification Alternatives

5-27

o

Purity Trends

5-31

o

Particulate Considerations

5-38

5.3

Deionized Water

5-40

5.3.1

Purification Techniques

5-40

5.3.2

Water Recycling

5-41

5.4

Processing Equipment

5-43

5.4.1

Detection Methods

5-43

5.4.2

Removal Techniques

5-44

Chapter 6 

Market Forecast

6-1

6.1

Market Forecast Assumptions

6-1

6.2

Cleanroom Construction

6-2

6.2.1

Cleanroom Design Criteria

6-2

6.2.2

Class 1 Construction Costs

6-12

6.2.3

Cleanroom Forecast

6-14

6.3

Forecasts of Liquid and Gas Filters

6-29

6.4

Gas Purification Systems Market

6-32

Chapter 7 

Strategic User Issues

7-1

7.1

Cleanroom Personnel

7-1

7.2

User Requirements

7-4

7.2.1

Benchmarking a Vendor

7-4

7.3

Need for Standardization

7-8

Chapter 8 

Strategic Supplier Issues

8-1

8.1

Process Equipment Cleanliness

8-1

8.2

Supplier Strategies

8-5

8.3

Supplier Opportunities

8-8

LIST OF FIGURES

1.1

Yield Vs. Defect Density

1-2