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Chemicals
And Materials For Sub-100 nm IC Manufacturing |
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TABLE OF CONTENTS |
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Chapter 1 |
Introduction |
1-1 |
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Chapter 2 |
Executive Summary |
2-1 |
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2.1 |
Key Industry Trends |
2-1 |
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2.2 |
Market Outlook |
2-4 |
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2.3 |
Supplier Opportunities |
2-6 |
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Chapter 3 |
IC Industry Trends |
3-1 |
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3.1 |
IC Industry Growth Forecast |
3-1 |
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3.2 |
Trends in IC Processing Technology |
3-5 |
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Chapter 4 |
Liquid Chemicals |
4-1 |
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4.1 |
Technology Issues |
4-1 |
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4.1.1 |
Acids and Solvents |
4-1 |
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4.1.2 |
Resists |
4-6 |
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4.2 |
Purity Requirements |
4-20 |
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4.2.1 |
Purification Methods |
4-20 |
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Trends For Purity - Trace Elements |
4-20 |
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4.2.2 |
Particulates |
4-21 |
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Effects on Yield |
4-21 |
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Particulate Removal Techniques |
4-26 |
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Particle Monitoring |
4-27 |
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4.3 |
Chemical Management |
4-28 |
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Chapter 5 |
Gases |
5-1 |
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5.1 |
Technology Issues |
5-1 |
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5.2 |
Requirements |
5-3 |
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5.2.1 |
Purification Methods |
5-3 |
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Historical Perspective |
5-3 |
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Trends For Purity - Consistency |
5-4 |
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5.2.2 |
Particulate Considerations |
5-6 |
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Particle Monitoring |
5-6 |
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Filtration Methods |
5-8 |
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5.2.3 |
Summary |
5-9 |
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5.3 |
Chemical Management |
5-10 |
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Chapter 6 |
Sputtering and Evaporation Materials |
6-1 |
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6.1 |
Technology Issues |
6-1 |
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6.2 |
Purity Requirements |
6-8 |
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Chapter 7 |
Chemical Dispensing Practices |
7-1 |
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7.1 |
Vendor Delivery Alternatives |
7-1 |
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7.1.1 |
Bottles |
7-1 |
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Glass & Polyethylene |
7-1 |
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7.1.2 |
Bulk Chemical Delivery |
7-3 |
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7.2 |
Point-of-Use Chemical Generation |
7-5 |
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7.3 |
Chemical Management Services |
7-8 |
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7.3.1 |
Introduction |
7-8 |
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7.3.2 |
Process Initiation |
7-14 |
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7.3.3 |
CMS Supplier Responsibilities |
7-16 |
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7.3.4 |
Improved Chemical Use |
7-17 |
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7.3.5 |
JIT Inventory Management |
7-17 |
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7.3.6 |
Environmental Services |
7-19 |
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7.3.7 |
Optimized Chemical Delivery |
7-20 |
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7.3.8 |
Reprocessor Management |
7-21 |
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7.3.9 |
Cost/Benefits |
7-21 |
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7.3.10 |
Trends |
7-22 |
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Chapter 8 |
Market Forecast |
8-1 |
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8.1 |
Market Driving Forces & Assumptions |
8-1 |
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8.2 |
Chemicals and Materials Forecast |
8-3 |
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8.2.1 |
Forecast By Chemical and Material |
8-3 |
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8.2.2 |
Chemical Use Per Unit Area Of Silicon Processed |
8-29 |
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8.2.3 |
Market Shares |
8-31 |
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8.2.4 |
NF3 Market Analysis |
8-39 |
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NF3 Market Forecast |
8-39 |
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NF3 Capacity Forecast |
8-43 |
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Chapter 9 |
Strategic Customer Issues |
9-1 |
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9.1 |
Benchmarking a Vendor |
9-1 |
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9.1.1 |
Statistical Quality Control |
9-1 |
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Assay and Related Items |
9-3 |
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Trace Elements |
9-4 |
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Particles |
9-5 |
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9.1.2 |
Analytical Capabilities |
9-6 |
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9.1.3 |
Product Manufacturing and/or Sourcing |
9-8 |
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Hydrofluoric Acid |
9-9 |
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Sulfuric Acid |
9-12 |
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Hydrogen Peroxide |
9-13 |
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Acetic Acid |
9-13 |
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Nitric Acid |
9-14 |
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Ammonium Hydroxide |
9-14 |
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Phosphoric Acid |
9-14 |
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Solvents |
9-15 |
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9.14 |
General Considerations |
9-15 |
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Installation and Retrofitting Costs |
9-15 |
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9.2 |
In-House Quality Control And Assurance |
9-18 |
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9.2.1 |
Analytical Tools |
9-18 |
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9.2.2 |
How Much Testing |
9-20 |
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LIST OF FIGURES |
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3.1 |
Minimum Feature Size for Dynamic RAMs With Time |
3-6 |
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4.1 |
Relationship Between Device Yield and Particles |
4-23 |
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4.2 |
Relationship Between Die Yield and Chip Size |
4-24 |
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4.3 |
Chemical Management Services Tasks |
4-29 |
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6.1 |
ITRS Roadmap |
6-3 |
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8.1 |
Chemical/Semiconductor Revenue Ratio |
8-11 |
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8.2 |
Worldwide Resist Market |
8-13 |
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8.3 |
Worldwide Resist Market by Geographic Region |
8-14 |
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8.4 |
Resist/Semiconductor Revenue Ratio |
8-15 |
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8.5 |
Worldwide Resist Ancillary Market |
8-21 |
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8.6 |
2001 Silicon Wafer Market |
8-27 |
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8.7 |
2006 Silicon Wafer Market |
8-28 |
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8.8 |
Cost of Chemicals Per Square Inch of Silicon |
8-32 |
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8.9 |
2002 Worldwide Market Shares for Gas Suppliers |
8-34 |
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8.10 |
2002 Worldwide Market Shares for Liquid Chemical
Suppliers |
8-35 |
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8.11 |
2002 Worldwide Market Shares for Photoresist Suppliers |
8-36 |
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8.12 |
2002 Worldwide Market Shares for Silicon Wafer Companies |
8-38 |
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LIST OF
TABLES |
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3.1 |
Interconnect Levels Of Logic Device |
3-7 |
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4.1 |
Common Wafer Processing Chemicals |
4-2 |
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4.2 |
Photoresist Stripping Solutions |
4-14 |
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4.3 |
Wet Stripping Systems |
4-18 |
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5.1 |
Gas Control System Issues |
5-2 |
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5.2 |
Potential Hazards of Processing Gases |
5-7 |
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7.1 |
Worldwide Growth of CMS |
7-12 |
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7.2 |
Cost of Ownership of CMS |
7-24 |
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8.1 |
Worldwide Forecast of Chemicals and Materials for IC
Manufacture |
8-4 |
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8.2 |
Worldwide Liquid Chemical Market by Chemical |
8-7 |
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8.3 |
U.S. Resist and Ancillary Market |
8-17 |
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8.4 |
Worldwide Market Forecast of Si Wafers |
8-25 |
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8.5 |
Worldwide Market Forecast of Sputtering Targets |
8-30 |
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8.6 |
Worldwide NF3 Market Forecast |
8-40 |
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8.7 |
Worldwide NF3 Capacity |
8-44 |